Job Description

6 to 12 yearsYou must possess a Bachelor/Master degree in electronics/electrical/communication/VLSI/Microelectronics and/or related engineering/technology with experience in the range of 6 to 12 years in SoC structural/physical design primarily focusing on SoC level power delivery network design, modeling/analyses, bump planning, IR Drop & ESD analyses. Experience in platform and package level power integrity, mother board/package/SoC level VR design is an added advantage. Publications and patents in relevant fields is preferred. Below are some of the specific expectations for this role - Solid understanding of power delivery focused microelectronic circuit design fundamentals and semiconductor device - Expertise in digital design, layout and be capable of interfacing with other teams - Ability to clearly express technical concepts in verbal and written form - Innovative thinking, problem solving, good communication skills, self-discipline and results orientation are critical soft-skills needed - Good hands-on knowledge on industry standard EDA tools & HDLs - Good hands-on knowledge of using scripting languages would be an added advantage

Key skill Required


  • Project manager